High Efficiency Liquid-type Cooling and Packaging Technology for a Miscellaneous Application of Microprocessors

摘要：

A new liquid cooling system with compact packaging and high operation efficiency for a miscellaneous application of microprocessors is designed, fabricated and tested. To enhance the efficiency of heat absorption, the feasible cold- plate and pin-fan cooling structures with multichannels are arranged and realized to reduce flow impedance by increasing surface cooling contact area and inducing high speed eddy flow for exchanging heat quickly. Numerical simulations of computational fluid dynamics by finite element methods indicate that the innovation patterns can significantly increase liquid cooling effect and the increase packaging performance.Experiment results show that proposed cooling and packaging technologies has good heat transfer characteristic and is feasible for applications. The best operation results and the best aspects of the developed systems are analyzed to challenge limited pressure drop and good thermal resistance is 0.182 with better uniformity that would be applied for miscellaneous microprocessor applications.

关键词： Cold-plate Liquid-type Cooling Multi-channels,Cooling Package Technology.

作者: San-Shan Hung Hsing-Cheng Chang You-Lun Chen Ming-Hua Liu

作者单位: Department of Automatic Control Engineering, Feng Chia University, Taichung, 40724 Taiwan, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 540-543

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）