Direct Chip Attachment (DCA) Packaging of a 2-D Thermal Flow Sensor
The design and fabrication of a DCA packaged thermal flow sensor, as well as the simulation and test results were presented in this paper. The fabricated flow sensor was glued to the backside of PCB board with the adhesive, and wire bonded to front side of the PCB through a prefabricated hole,and then the chip was capsulated using thermal insulated resin on the front side. The test results matched well with the predicted value, with an error no more than 8％.
Guangping Shen Jian Wu Hua Zhang Ming Qin Qingan Huang
Key Laboratory of MEMS of Education Ministry, Southeast University, Nanjing 210096, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
549-551
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）