An Edge-View-Photodetector for Simplification of Optical Packaging
A new 850 nm Edge-View-PhotoDetector (EVPD) was designed, fabricated and measured. The EVPD is designed to simplify optical packagings in an optical interconnects system by eliminating the using of turning mirrors and microlenses. The PIN active area of the photodetector is fabricated on a sloping sidewall of mesa structures. The resulting photodetector becomes edge viewing while the electrical pads remain horizontal. The EVPD fabrication process and initial measurement results are presented in this letter. The main processing steps include deep anisotropic chemical etching, material growth on slope and lithography on 3-D microstructure.
EVPD optical packaging optical interconnect epitaxy 3-D microstructure
Zhihua Li Huajun Shen Chengyue Yang Baoxia Li Lixi Wan
Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
563-565
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）