Electrodeposition of Palladium Film on Electroless Ni-P Coatings Supported by Si Substrate

摘要：

A transition layer of Ni-P coating will help enhance the hydrogen sensing stability of Pd films supported by silicon wafers. In this work, Pd films were electrodeposited on electroless Ni-P coated silicon wafers. The effect of deposition parameters on the microstructure (especially the morphology) of Ni-P coatings and Pd films were investigated.Experimental results indicated that a lower pH value of electroless plating solution and a longer electroless plating time could increase the size of Ni-P nodular particles. In addition, the morphology of Pd films was shaped by the nanostructures of the Ni-P coating. An optimized Pd /Ni-P structures is expected to present good hydrogen sensing performance.

作者: Xiang Gao Dongyan Ding Zhi Chen Ming Li Dali Mao

作者单位: Lab of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Department of Electrical and Computer Engineering, University of Kentucky, Lexington, KY 40506, USA

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 571-574

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）