Application of C-mode Scanning Acoustic Microscopy in Packaging
The reliability of integrated circuit (IC) packages depends in many respects on their mechanical integrity. The effect of structural weaknesses caused by poor bonding, voids,microcracks or delaminations may not be evident in the electrical performance characteristics, but may cause premature failure. C-mode scanning acoustic microscopy (CSAM) is an excellent tool for non-destructive failure analysis of IC packages. It has exhibited good sensitivity to interface anomalies such as poor bonding, delamination, voids, cracks,and foreign material inclusions. The non-destructive ultrasonic test method using C-SAM is a common detection method for delamination or crack failures in semiconductors with reliable and relatively accurate results. This paper will demonstrate the effectiveness of C-SAM at non-destructively analysis from A-Scan, B-Scan, C-Scan and T-Scan respectively. And the capability of C-SAM in detecting IC surface corrosion will be also illustrated.
Lili Ma Shengxiang Bao Dechun Lv Zhibo Du Shilan Li
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu Sichuan 610054, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
591-596
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）