Packaging Failure Isolation with Time-Domain Reflectometry (TDR) for Advanced BGA Packages

摘要：

IC packages become increasingly complex, which make failure analysis (FA) very challenging. This paper presents advanced packaging failure isolation with time-domain reflectometry (TDR), where the efforts are put on comparative method investigation. Flip-chip ball grid array (fcBGA) and stacked-die low-profile fine-pitch BGA (stacked-die LFBGA)packages are used to demonstrate advanced packaging FA isolation with TDR and good practices in analysis are highlighted, including signature quality improvement and ground selection. The paper also uses software to mimic and observe TDR signature under various failure modes in order to study TDR behavior with different failure modes. The acquired observations are helpful in packaging FA isolation with TDR.

作者: Weiliang Yuan Wenhui Zhu Palei Win C.K.Wang H.B.Tan Anthony Y.S.Sun

作者单位: United Test and Assembly Center, 5 Serangoon North Ave 5, Singapore 554916

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 597-600

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）