Insulation Degradation and Bias Acceleration Effect Study under THB Test
It is well known that temperature humidity bias (THB)test is widely used to evaluate the moisture resistance of non-hermetic packages in semiconductor industry. The high humidity environment, high temperature and bias will reveal potential defects of package material and potential design problem that is hard to be detected at normal condition.In this paper, a double daisy chain structure substrate was designed to make the subsequent measurement more convenient.The insulation property degradation due to THB test was evaluated. The insulation property of dielectric material would get degradation with THB test time. But even the degraded resistance after 1100h THB test was still high enough to prevent dielectric failure occurring internal to the substrate.The acceleration effect of bias on THB test was studied.Increasing bias would greatly accelerate the THB test and shorten the test time. The acceleration factor of different bias was analyzed.
Jianwei Zhou Wei Zheng Minyi Lou Taekoo Lee
Samsung Semiconductor China R&D Co.Ltd.Science Plaza 7F, International Science Park, Suzhou Industrial Park, Suzhou, 215021, P.R.China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
613-616
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）