The Effect of Aging on Microstructures Evolution and Shear Behaviors in Lead-free Solder Joint

摘要：

In this paper, the influence of aging treatment on microstructures evolution and shear strength in Sn-3.0Ag-0.5Cu, Sn-4.0Ag-0.5Cu and Sn-3.5Ag lead-free solders were investigated. For comparison, the specimens as-soldered and after aging at temperature of 100℃ were respectively put up observation for IMC and shear test.Morphology, microstructure and component at interface of solder joint were observed and analyzed. The results show that morphology and microstructure of intermetallic compound change form long needle-like to scallop-like, and the thickness and quantity of intermetallic compound increases with increasing aging time. Shear load of the lead-free solder joint decreases at constant strain rate with increasing aging. At the identical work condition, the shear load of solder joint with different lead-free alloy had not significantly change.Sn-3.5Ag presents the better shear property than the others

作者: Minghui Yang Fangjuan Qi Yaping Ding Deliang Ren Changling Xu

作者单位: Shijiazhuang Railway Institute, Shijiazhuang, Hebei 050043, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 671-673

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）