A New Approach for the Evaluation of Interfacial Reliability in Micro-scale

摘要：

Lead-free solder/copper single crystal joints were prepared to reveal the interracial fatigue damage mechanisms.Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the lead-free solder/copper single crystal joint. The types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC,were observed. Based on the damage modes of the IMC interface, the interfacial reliability can be well evaluated in micro-scale.

作者: Qingsheng Zhu Zhefeng Zhang Jianku Shang Zhongguang Wang

作者单位: Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 685-687

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）