Board Level Thermal Cycle Reliability of BGA for a New Type of Pad Structure with OSP Surface Finish

摘要：

In this paper, the effect of a new type of pad structure in which the copper pad is half etched with OSP surface finish on board level thermal cycle reliability of BGA is evaluated comparing conventional flat pad with ENIG surface finish.The test data is presented, including resulting Weibull analyses indicating characteristic life. The solder joint with flat pad Ni/Au surface finish has a little longer lifetime than that with dent pad OSP surface finish. A three dimensional finite element analysis is also applied and confirmed the experimental result. Two failure mechanisms for dent pad structure were observed, which decrease the thermal fatigue lifetime of the solder joints.

作者: Hai Liu Jing Zhang Song Chen Maohua Du Nufeng Feng Qian Wang Taekoo Lee

作者单位: Samsung Semiconductor China R&D CO.Ltd Science Plaza 7F, International Science Park, Su Zhou Industrial Park, Su Zhou 215021, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 698-700

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）