Warpage and Reliability of Three-dimensional Multi-chip Module with High Density Embedded Substrate

摘要：

The warpage of three-dimensional multi-chip module (3D-MCM) was studied by using viscoplastic finite element (FE) and large strain theory. The results turned out that: it is the existence of the cavity in substrate that results in the double-bow warpage and the inflection point of warpage-versus-temperature curve of substrate; Cavity in the substrate center may decrease the warpage of substrate;Proper usage of underfilling material could strengthen interconnection of device and substrate and could decrease warpage of 3D-MCM, however, the too big CTE of underfilling material may incur other new failure models.simulation and warpage prediction of 3D-MCM.

作者: Gaowei Xu Jian Zhou Le Luo

作者单位: Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 701-707

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）