Evaluation of the Thermal Resistance of CSOP24 Ceramic Package

摘要：

On the basis of MIL STD 883 method 1012 and SEMI standard G30-88 and G32-86, purely electrical approaches were implemented to measure the thermal resistance of CSOP24 package.Firstly the temperature sensitive parameter (TSP) was measured and calibrated in a temperature controlled fluid trough. Then proper test conditions including measurement current (IM) and test power PH were choosed according to experiments.Thermal resistance measurements were carried out in the two conditions: radiator with big heat sink which keeps the case temperature Tc at 60℃, and temperature controlled fluid trough. In addition, two kinds of thermal test chips with different size (1.91×1.91mm and 3.92×3.92mm) were used to test the influence of the chip size. Experimental result was provided. Moreover, the thermal resistance of the CSOP24 package was simulated by utilizing Fluent software.

作者: Xiao Peng Shuidi Wang Songliang Jia Jian Cai Qiang Huang Rongzhen Ding

作者单位: Institute of Microelectronics, Tsinghua University, Beijing, 100084, China Wuxi Microelectronics Research Centre, Wuxi China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 712-715

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）