Reliability Evaluation on Flexible RFID Tag Inlay Packaged by Anisotropic Conductive Adhesive
Interconnecting the RFID flip-chip on flexible antenna substrates by anisotropic conductive adhesive (ACA) is a preponderant technique to accomplish the low cost manufacturing of radio frequency identification (RFID) tag inlay. However, for the nature of hot compression bonding by adhesive, the frequency response function of RFID inlays often turns unstable and eventually goes to a response failure.In this work, ACA was prepared by mixing Ag particles into thermoset epoxy resin, and RFID flip chips were assembled on the aluminum antenna by ACA under 180 ℃, 12 sec, 1.4 MPa. It was found that the ACA has a comparatively high Tg and the fractograph shows that Ag conductive particles were captured by the gold bumps other than the aluminum antenna.The static tensile test and wind test reveals that the contact resistance of ACA joint rises up with the time or period increasing. Further, the outwards bend wind destructs more than the inwards bend wind on the contact conductivity of ACA due to its heavier tearing fatigue effect. The inlays remained 10 cm response distance after HHT test of 85 ℃, 85 ％RH, 168 hrs. In a word, the flexible RFID tag inlay assembled by ACA prepared here has an excellent flexibility and high reliability.
Xiong-hui Cai Bing An Xiao-wei Lai Yi-ping Wu Feng-shun Wu
Wuhan National Laboratory for Optoelectronics, State Key Laboratory of Plastic Forming Simulation and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
716-719
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）