Testing Solder Interconnect Reliability Under Drop Impact Loading Conditions
A common failure during the lifetime of most mobile devices is failure through dropping. This is nowadays tested by means of the drop impact test, which has been standardized by JEDEC. This method however takes quite some time and has some problems regarding reproducibility.This paper reports the work done on correlating the drop impact test with the cold bump pull that might be a replacement. The way of working is aimed at understanding the mechanical loading that causes failure and not on just fitting data. Therefore the drop impact test has been modeled and an experiment is prepared to verify this model which will be conducted in the near future. The cold bump pull test has been investigated to verify that the test is not biasing the bump into a certain failure mode, results are reported in this paper. The simulations regarding the cold bump pull are also presented as well.The two tests seem to be testing the same phenomena since the results from the CBP are indicating the same things as the drop impact tests but this is not yet proven since both simulation and experimental work is not entirely finished.
J.J.M.Zaal W.D.van Driel H.P.Hochstenbach G.Q.Zhang
Delft University of Technology, Faculty of 3ME, Precision and Microsystems Engineering, The Netherla NXP Semiconductors, IC Manufacturing Operations Back-End Innovations, The Netherlands;Delft Universi NXP Semiconductors, IC Manufacturing Operations Back-End Innovations, The Netherlands
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
734-739
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）