The Prediction of Sn-Ag Solder Properties Based on BP Algorithm of Artificial Neutral Network
In this paper, the prediction of properties of the lead-free solders were focused on by using the BP neural network.Then different algorithm and parameter of BP neural network has been used in the training process, and the results have been analyzed for obtaining the optimum algorithm and parameter. The influence of adding In. Bi, Sb, RE Cu to SnAg alloy to tensile strength, shear strength and the solidification temperature of Sn-Ag alloy was discussed in this paper. So the input variables are the contents of In. Bi, Sb,RE, Sn, Ag, Cu, and the output variable the tensile strength,shear strength and the solidification temperature of Sn-Ag alloy respectively. 15 groups of data were chosen for training of the model and 3 groups of data for prediction. The results show that the predicted data are good agreement with ones for the given experimental conditions. The accuracy and applicability for the present neural network modeling are thus verified.
Li Sun Fang juan Qi Zhezhe Hou Yuehua Xiao
Shijiazhuang Railway Institute, Shijiazhuang, Hebei 050043, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
740-742
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）