Test and Health Monitoring of Microelectronics using RFID
Interest has been growing in monitoring the ongoing health of systems and products in order to predict failures,provide warning to avoid catastrophic failures, reduce lifecycle costs and enhance their operational efficiency. This paper reviews the current state-of-the-art techniques and innovations of health monitoring of microelectronics using contactless testing. The paper explains the conventional methods of healthmonitoring (e.g. MTBF method), some state-of-research approaches (e.g. BIT, LCM, UAP, etc) and their advantages and disadvantages as well as some newer methods developed recently (e.g. physics-of-failure based method). The latest technique of health monitoring using Radio Frequency Identification (RFID) is addressed. RFID chips can be used to test the failures in Integrated Circuits (ICs) during the packaging process. This test technique is contactless and cost effective and can be used to test the die after every process in the production line of IC manufacturing. It provides advantages like higher reliability,added functionality and increased throughput. RFID chips that are being used during production cycle for testing can also be sensors).
T.Keinhorst P.Tsigkourakos M.A.Yaqoob W.D.van Driel G.Q.Zhang
Delft University of Technology, Dept.of 3mE, Mekelweg 2, 2628 CD Delft, Netherlands Delft University of Technology, Dept.of 3mE, Mekelweg 2, 2628 CD Delft, Netherlands;NXP Semiconducto
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
759-764
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）