TEM Study of Bi Segregation in the Interconnect of Eutectic Tin-Bismuth Solder and Copper

摘要：

The interfacial reaction between eutectic SnBi and Cu was studied by TEM after the sample was reflowed and aged in solid state, respectively. The microstructural evolution at the SnBi/Cu interface during reflowed and solid-state aged process was analyzed. The results show that there are two layers of intermetallic compounds (IMCs), Cu3Sn and Cu6Sn5, located at the interface between solder and Cu after the sample was reflowed. The segregation of Bi at the interface between Cu3Sn and Cu was observed. Furthermore,the segregation of Bi induced the formation of voids at Cu3Sn/Cu interface during solid-state aging process.

作者: P.J.Shang Z.Q.Liu L.Zhang D.X.Li J.K.Shang

作者单位: Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 765-767

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）