Experimental Study of Dye Penetration in Plastic Encapsulated Microcircuit
A potential reliability problem in plastic encapsulated microcircuits (PEMs) is moisture absorption and chemical ingress, which caused by the micro-crack or delamination of lead frame in the device. This paper describes the fluorescent dye penetration experimental setup that is used to reveals the leak pathways or the micro-crack in the PEM device. The visual evidence of the suspected defect can be seen by fluorescence under ultraviolet light. Experimental results are then presented, which show that the penetrant got into the inside of the sample only along the interface between the different materials. It indicates that the fluorescence dye penetration experiment is efficient in the detection of the delamination and cavity for the PEMS.
Hongxing Gai Jing Wang Shixin Chen Xiang Ren Li Gao
Center of Destructive Physics Analysis, China Electronics Standardization Institute Anding Men East Street, BeiJing 100007, PR China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
774-776
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）