Reliability Analysis of Lead-free Flip Chip Solder Joint

摘要：

The purpose of this paper is to study effect of thermal cycle condition on the reliability of lead-free flip chip solder joint. Flip chip assembly was subjected to thermal cycle (MIL-STD-883) condition. Two dimensional Finite Element Analysis (FEA) has been carried out using ANSYS commercial software. There are two types of lead-free solder (Sn96.5-Ag3.5 and Sn95.5-Ag3.8-Cu0.7). They used flip chip solder joints have been evaluated. For each lead-free flip chip solder joint, thermal stress and strain have been studied. The plastic strain is mainly effect on thermal fatigue of solder joint, so two types of lead-free solder joint compare with Sn63-Pb37 solder joint in equivalent plastic strain, and thermal fatigue life of these three types of solder joint has been analyzed and assessed.

作者: Dong Wang Xiaosong Ma Dan Guo

作者单位: School of Electromechanical Engineering, Guilin University of Electronic Technology, Guilin, Guangxi 541004, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 787-791

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）