Image Inspecting System of Positioning Accuracy of the Die Bonder

摘要：

This article realizes online inspection of the positioning accuracy of the high speed die bonder by using LabVIEW,IMAQ Vision and Motion, combined with the PCI-1409 images acquiring and PCI-7330 motion control hardware devices and image processing algorithm such as image calibration, image enhance, and pattern matching.

作者: Xiangxiu Huang Ketian Li Jian Liu Jian-qi Liu Ji-zhao Weng

作者单位: Faculty of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, Guangdong, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 796-799

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）