FEM Analysis of Moisture Distribution in Stacked Die Package

摘要：

Stacked Die Packaging technology is the key technique to meet the requirements of higher density, smaller size of electronic products. Moisture has big influence on the reliability of packaging, in which the major failures are corrosion, delamination and crack. In stacked die packages,the main risks of the moisture also exist. The focus of this paper is to investigate the hygroscopic characteristc of stacked die using commercial FEA software. In this study,according to the JEDEC standard, the moisture diffusion characteristic under different conditions is investigated.Results show that the substrate and bottom adhesive absorb rapidly in moisture diffusion simulation. This reduces the mechanical properties of the stacked die and the result may give a proper answer to those failure observed in industry.More tests are needed in order to get a more precise investigation.

作者: Z K Hua C Y Li Y X Luo L Q Cao J H Zhang

作者单位: Key Laboratory of Advanced Display and System Applications (Shanghai University), Ministry of Educat Intel Technology Development (Shanghai) Co., Ltd.

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 805-808

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）