Predicting the Reliability of Power Electronic Modules

摘要：

This paper discusses the reliability of an IGBT Power Electronics Module. This work is part of a major UK funded initiative into the design, packaging and reliability of power electronic modules. The predictive methodology combines numerical modeling techniques with experimentation and accelerated testing to identify failure modes and mechanisms for these type of power electronic module structures. The paper details results for solder joint failure substrate solder.Finite Element Method modeling techniques have been used to predict the stress and strain distribution within the module structures. Together with accelerated life testing, these results have provided a failure model for these joints which has been used to predict reliability of a rail traction application.

作者: C.Bailey H Lu T.Tilford

作者单位: School of Computing and Mathematical Sciences, University of Greenwich, London, UK

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 809-813

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）