Oxidation failure of Lead Frame Copper alloys with Surface Electroplated Pure Cu

摘要：

Influence of surface electroplated pure copper on oxidation failure of lead frame copper alloys for IC package were investigate. Pure copper layer will benefit the diffusion of copper ion, so the thickness of copper oxide films increase but the velocity of CuO formation decrease and the oxidation.only occurs at pure copper layer. As electroplating pure copper layer on copper alloy exceed a critical thickness,surface electroplating treatment can improve copper alloys resistance against oxidation failure greatly. The oxide film structure of copper alloys is CuO/Cu2O/Cu substrate, after electroplate treated, and the oxide film structure change to CuO (no or trace)/Cu2O/Cu. The oxide films with only Cu2O have higher adhesion strengths.

作者: Xi Chen Anmin Hu Ming Li Hong Shen Dali Mao

作者单位: Lab of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 818-821

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）