Semi-enclosed Cold Forging Process Analysis and Progressive Die Design of CPU Fin

摘要：

This paper analyzes the forming process methods of fin used in CPU chip to emit heat. The whole process is blanking, the first forging forming, the second forging (sizing), and trimming. The chamfer design of CPU fin blank is simulated by finite element analysis. The optimized chamfer 1.6 mm is available. Semi-enclosed cold forging of progressive dies is put forward. The transfer unit that newly designed is applied, which unifies the merit of high efficiency of the progressive dies and the high material-using ratio of the project die. Quick disassembly structure is designed and pins are used as quick disassembly pins by means of ball bearing bushing. The unique processing of the shearing scrap structure is adopted when designing the inverted trimming dies. Compared with the traditional die, the mechanization and electrization are realized to increase the production efficiency and get highly precise CPU fin.

关键词： CPU fin Two stage forging Progressive die Transfer unit Finite element analysis

作者: Juan-hua SU Feng-zhang Ren Lei WANG

作者单位: Mater.Sci.＆Eng.College, Henan University of Science and Technology, Luoyang 471003, China

会议类型: 国际会议

会议名称: The Fifth International Conference on Physical and Numerical Simulation of Materials Processing(第五届材料与热加工物理模拟及数值模拟国际会议)

会议地点: 郑州

会议语种:英文

在线出版日期: 2007-10-23（万方平台首次上网日期，不代表论文的发表时间）