Simulation of Three-Dimensional Stress Distribution in Compression Dies
The stress fields of rectangular and T shape compression dies were simulated by using three-dimensional photo-elasticity of stress freezing method. The rules of stress distribution of σx, σy, σz on the surface of rectangular and T-shaped dies were discovered, and the rules were also found inside the dies. The results indicate that the stress distribution of rectangular die is similar to that of T shape die. Obvious stress concentration in corner of die hole is observed. Σz rises from die hole to periphery until it achieves maximum value then it diminishes gradually, and σz between die hole and fix diameter zone is higher than it is in other position. At the same time, the equations of stress field of extrusion dies were obtained by curved surface fitting experimental values in every observed point with multiple-unit regression analysis method and orthogonal transforms. These works can provide stress distribution model for die computer aided design and computer aided make.
stress distribution compression dies simulation photo-elasticity
HUANG chuyun WANG Saiyu
School of Optoelectronics Science and Engineering, Huazhong University of Science and Technology, Wu Huangshi Institute of Technology, Huangshi, Hubei 435003;State Key Labortory of Die and Mould Techno
国际会议
郑州
英文
2007-10-23（万方平台首次上网日期，不代表论文的发表时间）