Finite-element analysis of thermal stresses in diamond film deposition on Mo substrate with Ti interlayer

摘要：

The effects of suppressing film cracking during large area freestanding diamond films deposition on Mo substrates with Ti interlayer were explored based on the finite-element code ANSYS. The analysis results were verified by experimental results. It showed that during large area freestanding diamond films deposition, Mo substrates with Ti interlayer have good effects on thermal stress relaxation and reduce the probability of crack initiation. High comprehensive quality diamond films were obtained at 950℃.

关键词： Finite element ANSYS Ti interlayer Free-standing diamond films Thermal stress

作者: Zheng LIU Cheng-ming LI De-cao NIU Hao LAN Wei-zhong TANG Guang-chao CHEN Jian-hua Song Yu-mei Tong Fan-xiu LU

作者单位: School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China

会议类型: 国际会议

会议名称: The Fifth International Conference on Physical and Numerical Simulation of Materials Processing(第五届材料与热加工物理模拟及数值模拟国际会议)

会议地点: 郑州

会议语种:英文

在线出版日期: 2007-10-23（万方平台首次上网日期，不代表论文的发表时间）