Moisture Absorption/Desorption Predictions and Thermal-Hygro-Mechanical Design for CMOS Image Sensor
A combined effect of moisture diffusion, heat transfer, thermo-mechanical, hygro-mechanical modeling and characterization for pre-mold QFN CMOS Image Sensor (CIS) package have been developed in this study. By using Fickian law, the “wetness technique under dynamic boundary conditions was applied to moisture absorption/desorption model at JEDEC pre-condition standard JESD22-A120. The three-dimensional finite element moisture diffusion model is developed to predict the overall moisture distribution among multi-materials. The moisture diffusion and hygroscopic swelling material properties under different temperature/humidity conditions have been measured for CIS package. The mismatch of coefficient of thermal expansion (CTE) as well as coefficient of moisture expansion (CME) for multi-material of CIS package was carefully investigated. An analytical expression for the total expansion strain due to thermo-hygro-mechanical coupled effect was proposed and the implementation procedures using finite element (FE) software ANSYS were described in details.
Finite Element Method Fickian Law Thermal-Mechanical Hygroscopic Stress CMOS Image Sensor JEDEC Pre-condition Standard
Hsiang-Chen Hsu Yu-Teng Hsu
No.1, Sec.1, Hsueh-Chen Rd., Ta-Hsu Hsiang, Kaohsiung County, Taiwan;Department of Mechanical and Automation Engineering, I-Shou University, Taiwan
国际会议
郑州
英文
2007-10-23（万方平台首次上网日期，不代表论文的发表时间）