INTERFACIAL STRESSES ANALYSES OF ANISOTROPIC CONDUCTIVE ADHESIVE BONDIG UNDER THERMAL AND HUMIDITY LOADS

摘要：

The interfacial stresses analysis of ACFs bonding has been done under thermal and humidity loads. Beam theory models have been used to derive the integral equation through the beam element analysis. The shear stresses and normal stresses of the interface can be obtained by solved the integral equations. The results of ANSYS simulation and calculation of the models agreed well. The effects of the material and geometry parameters to the interfacial stresses have investigated.

关键词： Anisotropic conductive adhesive films (ACFs) interfacial stresses analysis thermal and humidity loads

作者: Jun ZHANG Xu CHEN Xinli WEI Yongcheng LIN

作者单位: School of Chemical Engineering & Technology, Zhengzhou University, Zhengzhou, 450002, China;School o School of Chemical Engineering & Technology, Tianjin University, Tianjin, 300072,China School of Chemical Engineering & Technology, Zhengzhou University, Zhengzhou, 450002, China School of Mechanical & Electrical Engineering, Central South University, Changsha 410083, China

会议类型: 国际会议

会议名称: The Fifth International Conference on Physical and Numerical Simulation of Materials Processing(第五届材料与热加工物理模拟及数值模拟国际会议)

会议地点: 郑州

会议语种:英文

在线出版日期: 2007-10-23（万方平台首次上网日期，不代表论文的发表时间）