Diffusion bonding with a powder interlayer between Bi-Sr-Ca-Cu-O superconducting tapes
A new diffusion bonding technology with a direct uniaxial pressing at high temperature using a powder interlayer was applied to bond BSCCO multifilamentary superconducting tapes. The powder used as the precursor powder in the preparation of BSCCO tapes were applied as a bonding interlayer, which is mainly composed of Bi-2212 phases. The effects of holding time and uniaxial pressure on superconductivity and microstructures of the joints were investigated preliminarily in this study. The results indicate that appropriate holding time and uniaxial pressure during the diffusion bonding had positive effects on the formation of the metallurgical interface between the powder interlayer and superconducting cores in the lapping windows of the tapes, in the meantime, the 2212 phases could be partially transformed into 2223 phases. The critical current of the joints can reach 40％ of the original tapes.
diffusion bonding interlayer superconducting electrical properties microstructures of the joints
Yanjun WANG Guisheng ZOU Wei GUO Aiping WU Hailin BAI Jialie REN Xiuhua SONG Jun ZONG
Department of Mechanical Engineering, Tsinghua University & Key Laboratory for Advanced Manufacturin Beijing Innova Superconductor Technology Co., Ltd, Beijing 100176, China
国际会议
郑州
英文
2007-10-23（万方平台首次上网日期，不代表论文的发表时间）