THE LIQUID COOLING IN POWER ELECTRONIC

摘要：

Cooling electronic components is an increasing difficult task.Also forced air cooling have difficulties to match the performances required by the increasing power flow density in many applications like Telecom, Broadcasting, Power Supply, Motor Drives.The presentation, after a brief overview of the power electronic cooling needs, will describe the properties of different liquid cooling technologies and their application for distributed small sources and for power applications.Practical examples with comparative performances will be presented.

作者: Ing.Cesare CAPRIZ

作者单位: AAVID THERMALLOY Via XXV Aprile 32 - 40057 Cadriano (BO) - ITALY

会议类型: 国际会议

会议名称: PCIM China 2006(International Conference Power Electronics)(2006年中国电力电子技术国际会议)

会议地点: 上海

会议语种:英文

页码: 203-207

在线出版日期: 2006-03-21（万方平台首次上网日期，不代表论文的发表时间）