Design and Simulation of Computer Mainframe Cushion Packaging Based on FEM
The China import/export market is the worlds largest market. Today, import/export plays a very significant role in the China economy, where the total import/export grows nearly 43 times, as compared to twenty five years ago. Goods are frequently transported which are particularly sensitive to mechanical stresses and which must consequently be protected from damage due to impact, jolting or vibration in transit. They are thus additionally protected by cushioning materials inside the shipping packaging. The package design to help to prevent damage of product is extremely important in this situation.Traditional package test method is generally a destructive test with relatively high cost. Finite element method (FEM) as an advanced non-destructive test simulation method which simulates the real world can best match product-package design to the requirements of product and distribution can help to prevent damage while controlling packaging material and labor costs as well as shipping costs and packaging waste.In this paper a computer mainframes vibration characteristics before and after cushion package design under transportation condition is simulated based on FEM. First a geometry PRO/E model of the computer enclosure is set up and converted into ANSYS, then the model is analyzed and the computer mainframes natural frequencies are achieved. Next the package cushion system is designed and is analyzed utilizing FEM simulation which results decides whether the package cushion is fit for the vibration reduce requirement of the computer enclosure.
Computer mainframe Finite element analysis Simulation Cushion packaging design
WANG Hong ZHAO Yan
School of Computing Hubei University of Economy Wuhan, Hubei, 430205, China School of Mechatronic Engineering Wuhan university of technology Wuhan, Hubei, 430070, China
国际会议
厦门
英文
1-6
2006-07-27（万方平台首次上网日期，不代表论文的发表时间）