会议专题

Schottky Source/Drain MOSFETs on SiGe on Insulator with high-K gatedielectric and TaN gate electrode

We report thin SGOI (Silicon Germanium on Insulator) with 65% Ge concentration p- MOSFET (Metal-Oxide-Semiconductor-Field-Effect-Transistor)using Ni-germanosilicide Schottky S/D (source/drain) and HfO2/TaN gate stack integrated with conventional self-aligned top gate process. Unlike high temperature S/D activation needed for conventional transistor, low Ni-germanosilicide S/D formation temperature contributes to the excellent capacitance-voltage characteristic, low gate leakage current and hence, well-behaved transistor performance. In addition, SOI structure suppresses the junction leakage problem, resulting in good agreement between the source current and drain current of the MOSFET.

Fei Gao Rui Li D.Z.Chi S.Balakumar Chih-Hang Tung S.J.Lee

Silicon Nano Device Lab, Department of Electrical and Computer Engineering, National University of S Silicon Nano Device Lab, Department of Electrical and Computer Engineering, National University of S Institute of Materials Research Engineering, Singapore, 117602 Institute of Microelectronics Engineering, Singapore, 117685

国际会议

The Sixth International Workshop on Junction Technology(第六届国际结技术研讨会)

上海

英文

2006-05-15(万方平台首次上网日期,不代表论文的发表时间)