Progressive Power Supplies to Enable Coating and Etching Processes for Flat Panel Display Production
The substrate size in flat panel display production is still increasing. Glass sizes larger than two by two meters are becoming a standard. The scaling in substrate size has a direct consequence to the related process power used for deposition and etching processes and thus on the system requirements for radio frequency (RF) and mid frequency (MF) generators used for coating and etching processes. Advanced MF systems need a high precision process control and a supreme arc management with adaptable parameters to provide minimal disturbances hi the plasma process and to obtain optimized results in terms of film quality, homogeneity and optical properties of the deposited film or during an etching process. The new MF power supplies have an arc shut down time of less than 5 μs and a residual arc energy delivered into the process of less than 5 mJ/kW. Standard capacitively coupled RF plasma discharges are using 13. 56 MHz power supplies. The high power range up to 50 kW is covered by an oscillator-amplifier concept with a solid state driver in combination with a tube type endstage amplifier. Another trend especially for dielectric etching is the use of dual frequency capacitive discharges i. e. a high frequency RF source and a low frequency bias source. This has the advantage to independently control the ion density and the ion energy of the discharge. For this reason a dual frequency system with a masteroscillator (MOP) controlling both, the 13.56 MHz and 3.39 MHz generator has been developed.
Flat Panel Display Power Supplies Magnetron Sputter Deposition Dual Frequency Etching
Dirk Ochs Manfred Blattner Thomas Rettich
HUETTINGER Elektronik GmbH+Co KG, D-79111 Freiburg, Germany
国际会议
上海
英文
67-71
2007-03-12（万方平台首次上网日期，不代表论文的发表时间）