Analysis and Management of the Electro-thermal Effects in Analog Poly-Si TFTs for SoP Integration
For system-on-panel (SoP) integration, due to the substrate of poor thermal conductivity, the generated heat in the device channel can not be dissipated efficiently, thus causing serious self-heating effects. In this letter, such electro-thermal effects in analog thin-film transistors (TFTs) in SoP integration are investigated and compared with that in SOI technologies by numerical device simulation. The analysis highlights much more significant self-beating effects in SoP integration. A possible way to improve the thermal analog performance of the TFT is also discussed.
System-on-Panel (SoP) Thin-film Transistor (TFT) Self-heating Negative Output Conductance
Xiaojun Guo S. R. P. Silva
Nano-Electronics Centre, Advanced Technology Institute, University of Surrey, Guildford, Surrey GU2 7XH, UK
国际会议
上海
英文
579-582
2007-03-12（万方平台首次上网日期，不代表论文的发表时间）