会议专题

Activation of p-GaN in a Two-step Rapid Thermal Annealing Process

A two-step rapid thermal annealing process was optimized to activate magnesium doped gallium nitride layer (P-GaN). The optimized process consists of a long-term step (4 min) at 600℃ followed by a short-term step at 850℃ for 1 min. A hole concentration of 1.40×1018 cm -3 and a resistivity as low as 0.16Ω-cm were achieved for the activated sample. The specific contact resistance for Ni/Au-contacted p-GaN and the turn-on voltage of GaN-based LEDs was determined to be 1.0 × 10 -4 Ω ·cm2 and less than 3.2 V at 20 mA, which are improved results from those achieved by standard annealing process (750℃ for 20 min).

Light-emitting Diodes (LEDs) P-GaN Rapid Thermal Annealing

Zhinong Yu Yanfei Gao Jong-Wook Seo

Department of Optical Engineering, School of Information Engineering,Beijing Institute of Technology Information Science Department, School of Electrical and Information Engineering,Beijing Institute o School of Electronic and Electrical Engineering,Hongik University, Seoul 121 -791, Korea

国际会议

2007亚洲显示国际会议(AD07)

上海

英文

1577-1581

2007-03-12(万方平台首次上网日期,不代表论文的发表时间)