Development of Micro Conductive Ball for Anisotropic Conductive Film (ACF) Using Ultrafine Ni Nanoparticle Synthesized by Low Temperature Method
In this work, micro-sized conductive ball for 20 μm pitch fine pitch interconnection was successfully fabricated using ultrafine Ni nanoparticle of which size less than 5 nm. The ullrafme Ni nanoparticle was successfully synthesized using low temperature synthetic method, and was uniformly coated onto polymethylmethacrylate( PMMA) miro core ball. Thickness of the Ni coated layer was well controlled as intended. Also, Au was successfully plated onto the Ni coated layer by electrolessplating. Surface roughness of the Au/Ni coated ball is smooth due to the ultrafine and uniformly distributed Ni nanoparticle. The Au/Ni layer shows good adhesive and electrical properties of which resistance is 6 Ω/ball compatible to the fine pitch interconnection. So, micro-sized conductive ball was successfully fabricated compatible to 20 μm pitch interconnection.
Sung-Jei Hong Chul Jong Han Won-Geun Kim Gyu-Wan Jeong Jeong-ln Han
Information Display Research Center, Korea Electronics Technology Institute, Seongnam 463-816, Korea Jeong Eui Ind Co. Ltd., Hwaseong 445 -932, Korea
国际会议
上海
英文
1713-1717
2007-03-12(万方平台首次上网日期,不代表论文的发表时间)