Hygro-thermal mechanical analysis of flip chip package by finite element method
The purpose of this paper is to study the effect of moisture and thermal cycling loads on the reliability of flip chip ball grid array (FCBGA) packages using lead free and lead containing solders materials. Firstly, simplified thermal and mechanical finite element models are presented for the analysis of thermal stress during the thermal cycling testing. Anand model is selected to describe Ac material creep behaviors of 63Sn37Pb and 96.5Sn3.5Ag. Under the same loading condition, the performances of two kinds of solders are compared and give a good guideline on the lead free solders for replacement of lead containing solders materials. Secondly, for moisture diflusion modeling, thermal-moisture analogy is used to calculate the degree of moisture saturation in the multi-material system of FCBGA. Moisture diffusivity absorption at preconditioning temperature is modeled. The results offer theoretical support for interface delamination.
Xiao-yan Niu Zhi-gang Li Guo-zheng Yuan Xue-feng Shu
Institure of Applied Mechanics, Taiyuan University of Technology, Taiyuan 030024, China
国际会议
The 5th International Conference on Nonlinear Mechanics(第五届国际非线性力学会议)
上海
英文
829-832
2007-06-11（万方平台首次上网日期，不代表论文的发表时间）