Second order multi-scale micropolar model for microsystem interconnections
Anisotropic conductive adhesives (ACAs) are widely used in microsystem packaging due to their superior properties. The ACA joints are usually much smaller in scale than the neighboring adherends, and there are even finer internal structures included in the thin interconnection layer. The great difference in scale among these .constituents is a high challenge to both experimental technology and conventional numerical methods. A second order model based on micropolar theory is developed to take the mechanical responses of a typical internal structure in the ACA flip chip interconnection into account. In addition, by considering the typical structure under unit deformation, this model could also provide the supplementary information with regard to the stiffness coefficients for a previously developed homogenization interface model. And the simulation result obtained from the combination of two interface models agrees well with experimental observation.
Yan Zhang Johan Liu Jing-yu Fan Ragnar Larsson
Key Laboratory of Advanced Display and System Applications Shanghai University, Shanghai 200072, Chi Key Laboratory of Advanced Display and System Applications Shanghai University, Shanghai 200072, Chi Shanghai Institute of Applied Mathematics and Mechanics, Shanghai University, Shanghai 200072, China Department of Applied Mechanics, Chalmers University of Technology, SE-412 96 Gothenburg, Sweden
国际会议
The 5th International Conference on Nonlinear Mechanics(第五届国际非线性力学会议)
上海
英文
1434-1439
2007-06-11（万方平台首次上网日期，不代表论文的发表时间）