Thermal-Aware Placement Using Lagrangian Relaxation Combined with a Partition Scheme
Thermal-aware placement problem, which had received only moderate interest in the past, is gradually becoming a “hot spot in EDA. Essentially, it shows a nonuniform temperature distribution problem caused by the growing power consumption in modern high performance VLSI circuit designs. In this paper, in order to effectively decrease the maximal temperature on the die and lead to a comparatively uniform temperature distribution, we present a thermal placement algorithm for standard cell based layout: a Fiduccia-Mattheyses (FM) partition scheme proceeds; During each partition level the corresponding thermal quadratic programming problems are constructed and Lagrangian relaxation approach is used to solve them. The experimental results demonstrate our algorithms effectiveness.
VLSI circuit physical design thermal-aware placement partition scheme quadratic programming Lagrangian relaxation
Jing Li Hiroshi Miyashita
Department of Information and Media Sciences, University of Kitakyushu 1-1, Hibikino, Wakamatsu-ku, Kitakyushu, Fukuoka, 808-0135, Japan
国际会议
2006 International Conference on Communications,Circuits and Systems(第四届国际通信、电路与系统学术会议)
广西桂林
英文
2434-2438
2006-06-25（万方平台首次上网日期，不代表论文的发表时间）