会议专题

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

国际会议

the Conference of the 7th International Symposium on Eco-Materials Processing & Design(国际生态材料加工与设计大会)

成都

英文

554-557

2006-01-08(万方平台首次上网日期,不代表论文的发表时间)