会议专题

FEM analysis of stress and strain and evaluation on reliability of soldered CBGA joints under thermal cycling

国际会议

The 1st International Workshop on Advanced Metallic Materials and Processing Techniques for Aeronautical Applications(首届先进航空金属材料及加工技术国际会议)

南京

英文

317-322

2005-11-20(万方平台首次上网日期,不代表论文的发表时间)