A Boundary Integral Equation Based Surface Impedance Model in 3-D interconnects

摘要：

　　A novel boundary integral equation based method is proposed to compute the equivalent surface impedance in this letter.Different from the traditional algorithm to discretize the conductor cross section, the proposed method only discretizes the contour of the conductor cross section, thus reducing the computer memory and time cost.The loss characteristics of conductor describing the skin effect is taken into account through Green”s function.The equivalent surface impedance model can be utilized to simplify electromagnetic simulation only using electric field integral equation.Numerical results show that the proposed method is both efficient and accurate in a broadband frequency, which can be used for modeling of 3-D interconnects and integrated passive structures.

作者: Yu Zhao Shang Xiang Junfa Mao

作者单位: Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai, China

会议类型: 国内会议

会议名称: 2016年上海市研究生学术论坛——电子科学与技术

会议地点: 上海

会议语种:英文

页码: 20-23

在线出版日期: 2016-04-01（万方平台首次上网日期，不代表论文的发表时间）