Low-Temperature Ohmic Contact Formation in GaN High Electron Mobility Transistors Using Microwave Annealing
In this letter, a low-temperature microwave annealing (MWA) method is first reported for the formation of ohmic contact to AlGaN/GaN high electron mobility transistors (HEMTs).Compared with the traditional GaN devices annealed by rapid thermal annealing (RTA), MWA-HEMTs can achieve a low ohmic contact resistance with much smoother surface of ohmic contacts.The spike mechanism is observed in our ohmic contact annealed by microwave under a low-temperature condition.Besides, MWA-HEMTs have higher ION/IoFF ratio and lower gate leakage current than the fabricated RTA-HEMTs in this letter.
Lin-Qing Zhang Jin-Shan Shi Hong-Fan Huang Xiao-Yong Liu Peng-Fei Wang
ASIC & System State Key Laboratory, Fudan University, Shanghai 201203, China
国内会议
上海
英文
238-241
2016-04-01(万方平台首次上网日期,不代表论文的发表时间)