会议专题

Curing reaction mechanism of Bisphenol A ( BPA) epoxy by way of non-isothermal DSC and phenomenological model

  Studied the curing reaction of bisphenol A epoxy resin DER331 system by the way of non-isothermal DSC and phenom-enological model,using n-stage reaction and Malek Isoconversional method determined the curing kinetics equation,Identified the curing temperature and curing time curve,the results showed when the ratio of the epoxy resin DER331 and uring agent was 100 :30,the activation energy Ea was 46 950 J/mol,Frequency factor A was 2.08伊106/S,Constant curing temperature was 323.54 K,the reaction order of n was 0.89,curing time and curing temperature showed exponential relationship,comparing with DEH622 technical data Curing process parameters oproceeds between the curing temperature and time basically consistent with the actual experimental results,indicating that we can take advantage of DSC and dynamic characteristics of the phenomenological model of bisphenol A epoxy resin and hardener DEH622/DER331 system.

Bisphenol A epoxy resin phenomenological model curing reaction kinetics activation energy and reaction order curing temperature

Zhao Juan Zhao Juan Liu Guang Ye

Mechanical Engineering College of Qingdao University of Technology,Shandong province,Qingdao,zip cod Engineering Research Center of High Performance Polymer and Molding Technology of Ministry of Educat

国内会议

第十二届全国新型炭材料学术研讨会

长沙

英文

1-5

2015-11-05(万方平台首次上网日期,不代表论文的发表时间)