大面积反应磁控溅射的均匀性控制
Magnetron sputtermg is an mdustnal coating deposition technique which is commonly used in glass coatingmdustry in order to add functionality and properties to the base glass,properties such as antireflection,electrical conductivity,low emissMty are currently achieved thanks to magnetron sputtermg.Reactive magnetron sputtering occurs when thedeposited chemical composition of the coating substantially differs from the composition of the magnetron sputtermg targets,or coating physicochemical properties differ much of the sputtered or cosputtered target.Up to a certain pomt magnetron sputtering has been a tolerated necessity.GlassCoatmg Industry has”opted-out”on certam reactive sputtering processes in order to gain process stability and reproducibility The use of compound targets has already been adopted，and more recently TiOx which has the potential of replacmg Ti reactive sputtermg Most of these compound targets still would require a certain degree of reactive sputtermg,especially for large area deposition requiring lugh coating uniformity However,the general idea m those mstances has beento limit the required control level to a mmimum,almost entirely based on control of inputs rather than the momtormg ofoutputs One of the key elements m mamtammg a umform reactive sputtering process over a large area under control,is thesensor or sensors which are used as reference in the closed loop control.The lack of stable sensors,and/or msuse ormisplacement of sensors,has led the mdustry in many mstances to take safer options.The present paper would try tohighlight the current sensor availability with its pros and cons m large area uniform reactive magnetron sputtermg deposition。
玻璃 镀膜工艺 均匀性控制
V.Bellido-Gonzalez B.Daniel D.Monaghan J.Counsell
国内会议
广州
中文
44-51
2009-12-01（万方平台首次上网日期，不代表论文的发表时间）