Preparation of a new type of polyamidoamine and its application for soy flour-based adhesives
The most commonly used curing agents for soy-based adhesives are polyamines, which have the problem of low solid content and/or high viscosity.To overcome this problem, a new type of polyamidoamine (PADA) resin was synthesized and applied to soy flour-based adhesives to improve their water resistance.The obtained PADA solution had high solid content of 50wt% and low viscosity of 270cP.The optimum weight ratio of soy flour/PADA/maleic anhydride to prepare adhesive was40/7/1.68.The wet strength of plywood prepared at the optimum weight ratio was0.82MPa, which meant the plywood could be used as type II plywood according to the Chinese National Standard GB/T 9846.7-2004.The results of water-insoluble solid content measurement and SEM observation demonstrated that cured soy flour-PADA-Maleic anhydride adhesive had 16% greater water-insoluble solid content than soy flour-NaOH adhesive.The cross-linking network formed by the reactions of PADA and MA would increase water-insoluble solid contents and improve water resistance of cured soy flour-based adhesives.
Polyamidoamine resin Maleic anhydride soy flour-based adhesives water resistance cross-linking network
Chengsheng Gui Xiaoqing Liu Di Wu Tuo Zhou Guyue Wang Jin Zhu
Ningbo Key Laboratory of Polymer Materials, Ningbo Institute of Material Technology and Engineering, Chinese Academy of Sciences, Ningbo, Zhejiang 315201, P.R.China
国内会议
宁波
英文
1049-1065
2014-11-11（万方平台首次上网日期，不代表论文的发表时间）