Junction temperature measurement to optimize thermal design of LED arrays

摘要：

　　The drive to increased electrical currents input to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems.Hence,thermal management is a key design parameter as the temperature directly affects the maximum light output,quality,reliability and life time.For LED arrays,the arrangement will affect the thermal performance.In the design,junction temperature is very important to detect.However,because direct junction temperature determination is hard to detect due to the encapsulation,indirect methods are more preferred.Using the diode forward-voltage method is the most accurate one.Therefore,we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.

作者: Huaiyu Ye Hongyu Tang Stanley Leung Cheng Qian Xuejun Fan Guoqi Zhang

作者单位: Electronic Components,Technology and Materials,Delft University of Technology,Delft 2628 CD,The Neth Changzhou Institute of Technology Research for Solid State Lighting,Changzhou,213161,China State Key Laboratory of Solid State Lighting,Institute of Semiconductors,Chinese Academy of Sciences Department of Mechanical Engineering,Lamar University,Beaumont,Texas 77710,USA;State Key Laboratory Electronic Components,Technology and Materials,Delft University of Technology,Delft 2628 CD,The Neth

会议类型: 国内会议

会议名称: 第十二届中国国际半导体照明论坛

会议地点: 深圳

会议语种:英文

页码: 1-5

在线出版日期: 2015-11-02（万方平台首次上网日期，不代表论文的发表时间）