Machine Vision Applications in Copper Cap (with Needle) Measurement

摘要：

　　In the electronic industry,a number of small electronic components are difficult to measure by conventional methods,such as the capacitor”s anteroposterior on the motherboard,the chip size,the size of mobile phone”s batteries and so on.This article describes the measurement of copper cap (with needle) using machine vision,the measurement result well meets the customer”s needs.

关键词： Machine Vision Sub-pixel Measurement

作者: Bai-Ping LI Jun-Ni WU Xue-Yan ZHANG

作者单位: Xi”an university of science and technology,College of Communication and Information Engineering,Xi”a Chengdu Aeronautic Polytechnic,Computer Engineering Department,Chengdu,P.R.China 610100

会议类型: 国内会议

会议名称: 2014年国际计算机科学与软件工程学术会议

会议地点: 杭州

会议语种:英文

页码: 1-4

在线出版日期: 2014-10-18（万方平台首次上网日期，不代表论文的发表时间）