Sustained Immersion Tin Deposition on Copper from Choline Chloride Based Aqueous Solution without Reducing Agent
Sustained immersion tin (Sn) deposition onto a copper (Cu) surface was achieved from choline chloride aqueous (ChCl-H2O) solution free of reducing agents.The electrode potentials of Cu and Sn were investigated by open-circuit potential (OCP) to reveal the driving force of Sn deposition process in ChCl-H2O solution.Thiourea reversed the electrode potentials of Cu and Sn, causing the replacement reaction between Sn2+ and Cu occurring.The replacement reaction is significantly influenced by the concentration of ChCl, SnCl2, and thiourea.The phenomenon of sustained Sn deposition was mainly facilitated by diffusing of Cu into the Sn coating and the reaction between Sn2+ and Cu+.Furthermore, Sn coating got in ChCl-H2O solution had fairly good performance such as solderability.
Yurong Wang Jiawei He Wenchang Wang Mitsuzaki Naotoshi Zhidong Chen
School of Petrochemical Engineering, Jiangsu Province Key Laboratory of Fine Petrochemical Engineeri Taiyo Techno Service Co., Ltd, Osaka 554-0052, Japan
国内会议
2014(重庆)国际表面工程论坛暨第十二届全国表面工程·电镀与精饰年会
重庆
英文
188-196
2014-04-21（万方平台首次上网日期，不代表论文的发表时间）