Research and Development of New Generation High Voltage Flip Chip LED

摘要：

　　This paper presents the development and performance of a new generation of Direct Attach middle power 6V High Voltage Flip Chip (HVFC) LED designed to be directly attached using AuSn or SnAgCu solder by surface mount technology (SMT).Comparison is made against a standard 3V Flip Chip (FC) LED of equal chip dimension (780um x 380um).At 0.5W operation,both HVFC and FC have comparable Wall Plug Efficiency of 37% and Luminous Efficacy of 120lm/W at 6500K CCT,70 CRI.

会议类型: 国内会议

会议名称: 第十一届中国国际半导体照明论坛

会议地点: 宜昌

会议语种:英文

页码: 1-4

在线出版日期: 2014-05-15（万方平台首次上网日期，不代表论文的发表时间）